Xiaomi Unveils a 3nm Chip — and Claims a Mobile Benchmark First
Xiaomi unveiled the Xring O3, a TSMC 3nm SoC with 24 billion transistors, reported LPDDR6 support and a 5.22M AnTuTu score, debuting in the Xiaomi 18 Fold.
TL;DR — Xiaomi unveiled the Xring O3, a TSMC 3nm mobile chip with 24 billion transistors that the company says is the first mobile SoC to pass 5 million on AnTuTu and the first to support LPDDR6 — debuting in the Xiaomi 18 Fold in September.
Xiaomi keeps pushing to design its own silicon rather than buy it, and its newest chip is the most ambitious yet.
The chip
The Xring O3 is built on TSMC 3nm with 24 billion transistors (up 26% on its predecessor) in a 133mm² die, pairing a 10-core CPU peaking at 4.35GHz with a 16-core GPU. Xiaomi reported an AnTuTu score of 5,228,014 — which would make it the first mobile SoC past five million — and says it is the first mobile processor to support LPDDR6, at up to 10,667Mbps for 113.8GB/s of bandwidth, a 48% gain over the Xring O1. The NPU is rated up to 200 TOPS.
| Xring O1 | Xring O3 | |
|---|---|---|
| Process | — | TSMC 3nm |
| Transistors | — | 24 billion (+26%) |
| Memory bandwidth | baseline | 113.8GB/s (+48%) |
| AnTuTu | — | 5,228,014 |
Xiaomi has invested over 20 billion yuan (about $3 billion) in Xring against a pledged 50 billion yuan (about $7 billion) over a decade, growing the chip unit past 3,000 staff. The O3 debuts in the Xiaomi 18 Fold in September, with targeted shipments of only 200,000–300,000 units.
The details
The performance figures above are company claims made at Xiaomi’s chip conference, not independently verified. Reuters reported that neither Xiaomi nor TSMC confirmed the manufacturing arrangement when asked; the foundry and volume details came from unnamed sources. No individual executive was quoted in the coverage.
Why it matters
- Vertical integration is spreading. Phone makers increasingly want their own silicon roadmap.
- Volume is the tell. 200,000–300,000 units is a halo product, not a Qualcomm replacement.
- Treat the benchmark carefully. A first-past-five-million claim is the vendor’s own number.
FAQ
What is the Xiaomi Xring O3?
A TSMC 3nm mobile system-on-chip unveiled August 24, 2026 with 24 billion transistors, a 10-core CPU peaking at 4.35GHz and a 16-core GPU. Xiaomi reports an AnTuTu score of 5,228,014 and LPDDR6 support. It debuts in the Xiaomi 18 Fold in September.
Are the Xring O3 performance claims independently verified?
No. The figures are Xiaomi’s own claims from its chip conference. Reuters reported that neither Xiaomi nor TSMC confirmed the manufacturing arrangement when asked, and the foundry details came from unnamed sources.
Sources
- Yahoo Finance / Reuters — Xiaomi launches new Xring chip, partners with TSMC
- TrendForce — Xiaomi unveils 3nm Xring O3
Image: Xiaomi logo by Xiaomi; converted from AI to SVG by User:Kashmiri. — Public domain, via Wikimedia Commons.
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